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... area of 0.57 mm 2 excluding bonding pads and draws 4.1 mW from a 1 ...
... input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 ...
... input 4.4 Headphone output optimizition5 LED pads 5.1 LED driver 5.2 ...
... . The die area occupies 2.816 mm2 including pads and dissipates 106.9 mW power consumption with ...
... obtain joints defects information of the circuit board pads,solder in any cases,highprecision nondestructive testing ...
EDA技术-软件教材.docxAllegro设计流程Mentor Expedition教程PADS教程
